MSE Master of Science in Engineering

The Swiss engineering master's degree

Ogni modulo equivale a 3 crediti ECTS. È possibile scegliere un totale di 10 moduli/30 ECTS nelle seguenti categorie: 

  • 12-15 crediti ECTS in moduli tecnico-scientifici (TSM)
    I moduli TSM trasmettono competenze tecniche specifiche del profilo e si integrano ai moduli di approfondimento decentralizzati.
  • 9-12 crediti ECTS in basi teoriche ampliate (FTP)
    I moduli FTP trattano principalmente basi teoriche come la matematica, la fisica, la teoria dell’informazione, la chimica ecc. I moduli ampliano la competenza scientifica dello studente e contribuiscono a creare un importante sinergia tra i concetti astratti e l’applicazione fondamentale per l’innovazione 
  • 6-9 crediti ECTS in moduli di contesto (CM)
    I moduli CM trasmettono competenze supplementari in settori quali gestione delle tecnologie, economia aziendale, comunicazione, gestione dei progetti, diritto dei brevetti, diritto contrattuale ecc.

La descrizione del modulo (scarica il pdf) riporta le informazioni linguistiche per ogni modulo, suddivise nelle seguenti categorie:

  • Insegnamento
  • Documentazione
  • Esame
Advanced Electronic Design (TSM_AdvElDes)

This Advanced Electronic Design module gives to the students the key elements for the development of high performance electronic systems. These systems are characterized by:

  • a mixed-signal PCB (Printed Circuit Board)
  • the presence of sensitive analogue circuits and signals
  • the presence of complex and high-speed digital ICs (Integrated Circuits)

Requisiti

The student must have knowledge and experience in the following areas:

  • Circuit analysis
  • Electrical and magnetic fields
  • Active and passive electronic components, operational amplifiers
  • AD and DA conversion principle
  • Digital circuits

Obiettivi di apprendimento

  • The student masters the technologies used in the development of high-performance printed circuit boards.
  • The student is able to design a high-performance electronic board composed of sensitive analogue, mixed signal and high speed digital circuits.
  • The student is able to implement high-speed and high-resolution signal processing chains based on A/D and D/A converters, analogue functions blocs and complex digital ICs

Contenuti del modulo

The topics of this module can be grouped into three different subject areas. Therefore three courses are proposed. Each course is taught by a different person.

 

Course

Title

Weeks

Emphasis

1

High-performance PCB development :

  • PCB technologies: materials, multi-layers, micro vias
  • PCB design: EMC, signal integrity, grounding and power supply routing, decoupling, transmission lines and effects, simulation tools
  • Board assembly: IC package, chip-on-board, soldering, heat transfer, testability

1 – 4

~30%

2

High-speed digital electronic design :

  • high-speed signaling and timing, clock distribution, skew, jitter, latch-based design, low-power

5 – 8

~30%

3

Advanced analogue electronic design :

  • Advanced operational amplifier applications: low level and sensor signal conditioning, electronic noise, high-speed and low-power amplifiers, frequency response analysis
  • Advanced ADC and DAC implementations: high-speed, high-resolution, sigma-delta converter, low-power, anti-aliasing and post-filter

9 – 14

~40%

Metodologie di insegnamento e apprendimento

  • Lecture
  • Exercises
  • Presentation and discussion of case studies
  • Self-study of the presented cases and exercises

Bibliografia

Electromagnetic Compatibility Engineering, Henry W. Ott, Wiley, 2009.

The Op Amp Applications Handbook, Walt Jung, Analog Devices, 2006.

The Data Conversion Handbook, Walt Kester, Analog devices, March 2004.

High Speed Signal Propagation: Advanced Black Magic, Howard Johnson – Martin Graham, Prentice Hall, 2003.

Op Amps for everyone, Ron Mancini, Texas Instruments, 2002.

Scarica il descrittivo completo del modulo

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